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6-K 1 tsm-monthend6kx20230725.htm 6-K Document

1934 Act Registration No. 1-14700
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
_____________________________
FORM 6-K
_____________________________
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER
THE SECURITIES EXCHANGE ACT OF 1934
For the month of July 2023
(Commission File Number: 001-14700)
_____________________________
Taiwan Semiconductor Manufacturing Company Ltd.
(Translation of Registrant’s Name Into English)
_____________________________
No. 8, Li-Hsin Rd. 6,
Hsinchu Science Park,
Taiwan, R.O.C.
(Address of Principal Executive Offices)
_____________________________
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F  x            Form 40-F  o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):o


SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.


Taiwan Semiconductor Manufacturing Company Ltd.
Date:   July 25, 2023 By    /s/ Wendell Huang
  Wendell Huang
   Vice President and Chief Financial Officer
   



Taiwan Semiconductor Manufacturing Company Limited
("TSMC"; NYSE: TSM)
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):o This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors and 5) the unsecured bonds issued by TSMC and its subsidiaries for the month of June 2023.
1.The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
Title Name Number of shares held as of Changes
5/31/2023 6/30/2023
Chairman Mark Liu 12,962,473 12,963,007 534
Senior Vice President Cliff Hou 481,626 483,380 1,754
Vice President and Chief Financial Officer Wendell Huang 1,660,055 1,660,070 15
Vice President Jonathan Lee 385,137 387,223 2,086
Vice President KC Hsu 75,927 80,927 5,000
Note: Shareholdings include shares held by the related parties.
2.The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
Inapplicable.
3.The acquisition and disposition of assets by TSMC and its subsidiaries:
Fixed-income investment: NT$25.0 billion of acquisition.
Equity investment: NT$0.3 billion of disposition.
4.The capital appropriations approved by TSMC board of directors: Inapplicable.
5.The unsecured bonds issued by TSMC and its subsidiaries:
Issuance Tranche Issuance Period Total Amount
(in billions)		 Coupon Rate Repayment and Interest Payment
112-3 A June 2023 ~ June 2028 NT$11.4 1.60% Bullet repayment; interest payable annually
B June 2023 ~ June 2030 NT$2.6 1.65%
C June 2023 ~ June 2033 NT$6.0 1.80%