株探米国株
英語
エドガーで原本を確認する
6-K 1 a20240418.htm 6-K Document

1934 Act Registration No. 1-14700
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, DC 20549
_____________________________
FORM 6-K
_____________________________
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER
THE SECURITIES EXCHANGE ACT OF 1934
For the month of April 2024
(Commission File Number: 001-14700)
_____________________________
Taiwan Semiconductor Manufacturing Company Ltd.
(Translation of Registrant’s Name Into English)
_____________________________
No. 8, Li-Hsin Rd. 6,
Hsinchu Science Park,
Taiwan, R.O.C.
(Address of Principal Executive Offices)
_____________________________
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F  x            Form 40-F  o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):o Taiwan experienced an earthquake on April 3 reaching magnitude level 7.2 (the largest in Taiwan over the past 25 years).



SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.


Taiwan Semiconductor Manufacturing Company Ltd.
Date:   April 18, 2024 By    /s/ Wendell Huang
  Wendell Huang
Senior Vice President and Chief Financial Officer





TSMC Statement on the Impact of April 3rd Earthquake


The maximum magnitude measured at the Hsinchu, Longtan, and Zhunan science parks was 5, and reached magnitude 4 at the Taichung and Tainan science parks.

Based on TSMC's ample experience and capabilities in earthquake response and damage prevention, as well as regular disaster drills to ensure full readiness, overall tool recovery of our fabs reached more than 70% within 10 hours of the April 3 earthquake, with new fabs such as the Fab 18 facility reaching more than 80%. Thanks to the collaborative efforts of TSMC colleagues and our supplier partners, we were fully recovered by the end of the third day. At the same time, we are maintaining close contact with customers and communicating with them regarding impact as appropriate.

There were no power outages, no structural damage to our fabs, and there is no damage to our critical tools, including all of our EUV lithography tools. That being said, a certain number of wafers in process were impacted and had to be scrapped, but we expect most of the lost production to be recovered in the second quarter, and thus minimal impact to our second quarter revenue. We expect the total impact from the earthquake to reduce our second quarter gross margin by about 50 basis points, mainly due to the losses associated with wafer scraps and materials loss. TSMC maintains its full-year revenue guidance of low-to-mid-twenties percentage growth given at the January institutional investors' conference. Based on a preliminary assessment, the Company estimated related earthquake losses to be approximately NT$3 billion, net of insurance claim, and will recognize it in the second quarter of 2024.